Todd H. Hubing Publications and Presentations

Papers Published in Conference Proceedings

  1. T. Hubing, “EMC Expert systems for evaluating automotive designs,” Proc. of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, Aug. 2006, THPM-6-6.
  2. N. Kobayashi, T. Harada, A. Shaik and T. Hubing, “An investigation of the effect of chassis connections on radiated EMI from PCBs,” Proc. of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, Aug. 2006, WEAM-2-1.
  3. V. Kasturi, S. Deng, T. Hubing and D. Beetner, “Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements,” Proc. of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, Aug. 2006, WEPM-1-4.
  4. K. Morishita, N. Kobayashi, T. Harada, H. Ke and T. Hubing, “Modeling radiated emissions from cables attached to printed circuit boards driven by power bus noise,” Proc. of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, Aug. 2006, THPM-1-5.
  5. A. Shaik, H. Weng, X. Dong, T. Hubing and D. Beetner, “Matched Filter Detection and Identification of Electronic Circuits Based on their Unintentional Radiated Emissions,” Proc of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, Aug. 2006. (presented August 2005 in Chicago)
  6. S. Deng, J. Fan, J. Knighten, T. Hubing, J. Drewniak and N. Smith, “Application of transmission line models to backpanel plated through-hole via design,” Proc. of IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2005), Austin, Texas, Oct. 2005, pp. 99-102.
  7. T. Hubing, “Effective strategies for choosing and locating printed circuit board decoupling capacitors,” Proc. of the 2005 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, USA, Aug. 2005, pp. 632-637.
  8. H. Weng, X. Dong, X. Hu, D. Beetner, T. Hubing and D. Wunsch, “Neural network detection and identification of electronic devices based on their unintended emissions,” Proc. of the 2005 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, USA, Aug. 2005, 245-249.
  9. H. Ke and T. Hubing, “Using an LU recombination method to improve the performance of the boundary element method at very low frequencies,” Proc. of the 2005 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, USA, Aug. 2005, pp. 442-445.
  10. X. Dong, S. Deng, D. Beetner, T. Hubing and T. Van Doren, “Determination of high frequency package currents from near-field scan data,” Proc. of the 2005 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, USA, Aug. 2005, pp. 679-683.
  11. T. Hubing and A. Orlandi, “A brief history of EMC education,” Proc. of the 16th International Zurich Symp. and Technical Exhibition on EMC, Zurich, Switzerland, Feb. 2005, pp. 95-97.
  12. H. Weng, D. Beetner, T. Hubing, X. Dong, R. Wiese and J. McCallum, “Investigation of cavity resonances in an automobile,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 766-770.
  13. X. Dong, H. Weng, D. Beetner, T. Hubing, R. Wiese and J. McCallum, “A preliminary study of maximum system-level crosstalk at high frequencies for coupled transmission lines,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 419-425.
  14. H. Shim, Y. Fu and T. Hubing, “Radiated emissions from populated printed circuit boards due to power bus noise,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 396-400.
  15. R. Chen, J. Chen, T. Hubing and W. Shi, “Via coupling within power-return plane structures considering the radiation loss,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 386-391.
  16. X. Dong, S. Deng, T. Hubing and D. Beetner, “Analysis of chip-level EMI using near-field magnetic scanning,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 174-177.
  17. H. Shim, T. Hubing, T. Van Doren, R. DuBroff, J. Drewniak, D. Pommerenke and R. Kaires, “Expert system algorithms for identifying radiated emission problems in printed circuit boards,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 57-62.
  18. S. Deng, J. Mao, T. Hubing, J. Drewniak, J. Fan, J. Knighten, N. Smith, R. Alexander and C. Wang, “Effects of open stubs associated with plated through-hole vias in backpanel designs,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 1017-1022.
  19. T. Hubing, D. Beetner, S. Deng and X. Dong, “Radiation mechanisms for semiconductor devices and packages,” Proc. of the 2004 International Symposium on Electromagnetic Compatibility - EMC’04 Sendai, Sendai, Japan, June 2004, 3A1-3.
  20. T. Hubing, “Printed circuit board EMI source mechanisms,” Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility, Boston, MA, Aug. 2003, pp. 1-3.
  21. T. Hubing, “PCB EMC design guidelines: A brief annotated list,” Proc. of the 2003 IEEE International Symposium on Electromagnetic Compatibility, Boston, MA, Aug. 2003, pp. 34-36.
  22. H. Wang, C. Guo, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff, “Application of higher-order FEM elements to the analysis of microstrip structures,” Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, Aug. 2002, pp. 1015-1019.
  23. H. W. Shim, T. Zeeff and T. Hubing, “Decoupling strategies for printed circuit boards without power planes,” Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, Aug. 2002, pp. 258-261.
  24. S. Ranganathan, D. Beetner, R. Wiese and T. Hubing, “An expert system architecture to detect system-level automotive EMC problems,” Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, Aug. 2002, pp. 976-981.
  25. L. Zhang, K. Slattery, C. Wang, M. Yamaguchi, K. Arai, R. DuBroff, J. Drewniak, D. Pommerenke and T. Hubing, “Field extraction from near field scanning for a microstrip structure,” Proc. of the 2002 IEEE International Symposium on Electromagnetic Compatibility, Minneapolis, MN, Aug. 2002, pp. 589-592.
  26. T. Zeeff and T. Hubing, “Reducing power bus impedance at resonance with lossy components,” Proc. of the 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, Mass., Oct. 2001.
  27. C. Olsen, T. Van Doren, T. Hubing, J. Drewniak and R. DuBroff, “Improving the high-frequency attenuation of shunt capacitor, low-pass filters,“ Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 487-489
  28. M. Xu, T. Hubing, J. Chen, J. Drewniak, T. Van Doren and R. DuBroff, “Mitigating power bus noise with embedded capacitance in PCB designs,” Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 496-500.
  29. H. Wang, B. Archambeault and T. Hubing, “Challenge problem update: PEEC and MOM analysis of a PC board with long wires attached,” Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 811-814.
  30. H. Hu, T. Hubing and T. Van Doren, “Estimation of printed circuit board power bus noise at resonance using a simple transmission line model,” Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 896-898.
  31. H. W. Shim and T. H. Hubing, “20-H rule modeling and measurements,” Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 939-942.
  32. Y. Ji, B. Archambeault and T. Hubing, “Applying the method of moments and the partial element equivalent circuit modeling techniques to a special challenge problem of a PC board with long wires attached,” Proc. of the 2001 IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 1322-1326.
  33. M. Xu, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff, “Modeling printed circuit boards with embedded decoupling capacitance,” Proc. of the 14th International Zurich Symp. and Technical Exhibition on EMC, Zurich, Switzerland, Feb. 2001, paper# 96O2.
  34. T. Hubing and M. Xu, “Investigation of new materials for embedded capacitance in printed circuit boards,” Proc. of the APEX Electronics Assembly Process Conference, San Diego, CA, Jan. 2001.
  35. T. Hubing, M. Xu, J. Chen, J. Drewniak, T. Van Doren and R. DuBroff, “Printed circuit board power bus decoupling using embedded capacitance,” Proc. of the 4th European Symposium on Electromagnetic Compatibility, Brugge, Belgium, Sep. 2000, pp. 639-642.
  36. M. Xu, Y. Ji, T. Hubing, T. Van Doren, J. Drewniak and R. DuBroff, “Development of a closed-form expression for the input impedance of power-ground plane structures,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 77-82.
  37. D. Berg, Y. Ji, X. Ye, J. Drewniak, T. Hubing, R. DuBroff, T. Van Doren and M. Tanaka, “FDTD and FEM/MOM modeling of EMI resulting from a trace near a PCB edge,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 135-140.
  38. T. Zeeff, T. Hubing, J. Drewniak, R. DuBroff and T. Van Doren, “EMC analysis of an 18” LCD monitor,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 169-174.
  39. J. Chen, M. Xu, T. Hubing, J. Drewniak, T. Van Doren, and R. DuBroff, “Experimental evaluation of power bus decoupling on a 4-layer printed circuit board,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 335-338
  40. H. Wang, Y. Ji, T. Hubing, J. Drewniak, T. Van Doren and R. DuBroff, “Experimental and numerical study of the radiation from microstrip bends,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 739-742
  41. X. Ye, J. Drewniak, R. DuBroff, T. Van Doren, T. Hubing and J. Nadolny, “Experimental and FDTD study of the EMI performance of an open-pin-field connector for modules-on-backplanes,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 789-794.
  42. Y. Ji, T. Hubing and J. Drewniak, “Finite element modeling of patch antenna and cavity sources,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 811-814.
  43. X. Ye, W. Cui, J. Drewniak, T. Van Doren, T. Hubing, R. DuBroff, D. Hockanson, S. Radu, and M. Li, “The EMI benefits of ground plane stitching in multi-layer power bus stacks,” Proc. of the 2000 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 2000, pp. 833-838.
  44. Y. Ji, T. Hubing and H. Wang, “Techniques for optimizing FEM/MoM codes,” Proc. of the 16th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 2000, pp. 444-451.
  45. M. Li, J. Drewniak, T. Hubing, R. DuBroff, and T. Van Doren, “Slot and aperture coupling for airflow aperture arrays in shielding enclosure designs,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 35-39.
  46. Y. Ji, J. Chen, T. Hubing, and J. Drewniak, “Application of a hybrid FEM/MOM method to a canonical PCB problem,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 91-96.
  47. W. Cui, M. Li, J. Drewniak, T. Hubing, T. Van Doren, R. DuBroff and X. Luo, “Anticipating EMI from coupling between high-speed digital and I/O lines,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 189-194.
  48. M. Xu, J. Drewniak, and T. Hubing, “Signal induced EMI in fibre channel cable-connector assemblies,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 201-205.
  49. T. Zeeff, C. Olsen, T. Hubing, J. Drewniak and D. DuBroff, “Microstrip coupling algorithm validation and modification based on measurements and numerical modeling,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 323-327.
  50. X. Ye, J. Drewniak, T. Hubing, T. Van Doren, and R. DuBroff, “EMI associated with inter-board connection for module-on-backplane and stacked-card configurations,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 797-802.
  51. J. Fan, Y. Ren, J. Chen, J. Drewniak, T. Hubing, T. Van Doren and R. DuBroff, “RF isolation using power islands in DC power bus design,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 838-843.
  52. T. Hubing, J. Chen, J. Drewniak, T. Van Doren, Y. Ren, J. Fan, and R. DuBroff, “Power bus noise reduction using power islands in printed circuit board designs,” (Invited) Proc. of the 1999 Int. Symp. on EMC, Tokyo, Japan, May 1999, pp. 1-4.
  53. M. Tanaka, W. Cui, X. Luo, J. Drewniak, T. Hubing, T. Van Doren, and R. DuBroff, “FDTD modeling of EMI antennas,” Proc. of the 1999 Int. Symp. on EMC, Tokyo, Japan, May 1999, pp. 560-563.
  54. M. Li, S. Radu, J. Drewniak, T. Hubing, T Van Doren, R. DuBroff, “An EMI estimate for shielding enclosure design,” Proc. of the 13th International Zurich Symp. And Technical Exhibition on EMC, Zurich, Switzerland, Feb. 1999, pp. 369-374.
  55. J. Fan, H. Shi, J. Drewniak, T. Hubing, R. DuBroff and T. Van Doren, “Incorporating vertical discontinuities in power-bus modeling using a mixed-potential integral equation and circuit extraction formulation,” Proc. of the 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, Oct. 1998, pp. 171-174.
  56. Y. Ji, M. Ali, and T. Hubing, "EMC applications of the EMAP5 hybrid FEM/MOM code," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 543-546.
  57. S. Radu, R. E. DuBroff, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "Designing power bus decoupling for CMOS devices," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 375-380.
  58. H. Shi, J. Fan, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "Modeling multilayered PCB power bus designs using a MPIE-based circuit extraction technique," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 647-651.
  59. D. M. Hockanson, J.L. Drewniak, R. E. DuBroff, T. H. Hubing, and T. P. Van Doren, "Consideration of magnetic-field coupling resulting in radiated EMI," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 808-813.
  60. S. Radu, T. Zeeff, J. Nuebel, J.L. Drewniak, T.P. Van Doren, and T.H. Hubing. "The impact of layer stack-up on EMI," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 828-833.
  61. M. Li, S. Radu, J. Nuebel, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "Design of airflow aperture arrays in shielded enclosures," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 1059-1063.
  62. T. Hubing, N. Kashyap, J. Drewniak, T. Van Doren, and R. DuBroff, “Expert system algorithms for EMC analysis,” Proc. of the 14th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1998, pp. 905-910.
  63. Y. Ji and T. Hubing, “EMAP5: A 3D hybrid FEM/MOM code,” Proc. of the 14th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1998, pp. 928-935.
  64. N. Kashyap, T. Hubing, J. Drewniak, and T. Van Doren, "An expert system for predicting radiated EMI from PCBs," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 444-449.
  65. M. Li, Y. Ji, S. Radu, W. Cui, J. Drewniak, T. Hubing, and T. Van Doren, "EMI from apertures at enclosure cavity mode resonances," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 183-187.
  66. S. Radu, M. Li, D. Hockanson, Y. Ji, J. Drewniak, T. Hubing, and T. Van Doren, "Investigation of internal partitioning in metallic enclosures for EMI Control," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 171-176.
  67. S. Radu, Y. Ji, J. Drewniak, T. Van Doren, and T. Hubing, "Identifying an EMI source and coupling path in a computer system with sub-module testing," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 165-170.
  68. S. Britt, D. Hockanson, F. Sha, J. Drewniak, T. Hubing, and T. Van Doren, "Effects of gapped guard traces on radiated EMI," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 159-164.
  69. M. Li, S. Radu, J. Nuebel, J. Drewniak, T. Hubing, and T. Van Doren, "Reducing EMI through shielding enclosure perforations employing lossy materials: FDTD modeling and experiments," Proc. of the 13th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1997, pp. 1070-1076.
  70. H. Shi, F. Sha, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and F. Yuan, "Simulation and measurement for decoupling on multilayer PCB DC power buses," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 430-435.
  71. K. P. Ma, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "A comparison of an FDTD thin-slot algorithm and method of moments for modeling slots near corners," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 386-390.
  72. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and C. W. Lam, "Experimental and numerical investigations of fundamental radiation mechanisms in PCB designs with attached cables, Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 305-310.
  73. T. Hubing, J. Drewniak, T. Van Doren, and N. Kashyap, "An expert system approach to EMC modeling," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 200-203.
  74. T. Hubing and J. Drewniak, "Computer modeling tools for EMC," Proc. of the 12th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1996, pp. 857-860.
  75. J. L. Drewniak, F. Sha, T. H. Hubing, T. P. Van Doren, and J. Shaw, “Diagnosing and modeling common-mode radiation from printed circuit boards with attached cables,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 465-470.
  76. T. H. Hubing, T. P. Van Doren, F. Sha, J. L. Drewniak, and M. Wilhelm, “An experimental investigation of 4-layer printed circuit board decoupling,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 308-312.
  77. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “FDTD modeling of thin wires for simulating common-mode radiation from structures with attached cables,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 168-173.
  78. J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and F. Sha, “Integrating EMC laboratory exercises into undergraduate electromagnetics,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 35-40.
  79. J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and P. Baudendistal, “Modeling power bus decoupling on multilayer printed circuit boards,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 456-461.
  80. T. H. Hubing, T. P. Van Doren, and J. L. Drewniak, “Identifying and quantifying printed circuit board inductance,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 205-208.
  81. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “Application of the finite-difference time-domain method to radiation from shielded enclosures,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 83-88.
  82. R. L. Hill, T. P. Van Doren, T. H. Hubing, J. Drewniak, and F. Gisn, “Common mode currents induced on wires attached to multilayer printed wire boards with segmented ground planes,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 116-120.
  83. J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “Investigation of fundamental mechanisms of common-mode radiation from printed circuit boards with attached cables,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 110-115.
  84. T. H. Hubing, “A modular approach to numerical EM modeling,” Proc. of the IEEE APS Int. Symposium, Seattle, WA, June 1994, vol. 1, pp. 388-391.
  85. T. Hubing, C. Hong-Him Lim, and J. Drewniak, "A geometry description language for 3D electromagnetic analysis codes," Proc. of the 10th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1994, pp. 417-422.
  86. T. H. Hubing, P. Grover, T. Van Doren, J. Drewniak, and L. Hill, “An algorithm for automated printed circuit board layout and routing evaluation,” Proc. of the 1993 IEEE International Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 1993, pp. 318-321.
  87. T. H. Hubing and M. W. Ali, “EMC applications of EMAP-2: A 3D finite element modeling code,” Proc. of the 1993 IEEE International Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 1993, pp. 279-283.
  88. T. H. Hubing and M. W. Ali, “Learning about EM theory and EM modeling by analyzing printed circuit boards in an enclosure,” Proc. of the Ninth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1993, pp. 564-568.
  89. T. H. Hubing, “Using commercial CAD packages to interface with 3-D EM modeling codes,” Proc. of the Eighth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1992, pp. 607-610.
  90. T. H. Hubing, “Numerical techniques for EMI source modeling: A review of progress,” Proc. of the Eighth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1992, pp. 413-417.
  91. T. H. Hubing, “A survey of numerical techniques for modeling sources of electromagnetic interference,” Proc. of the Seventh Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1991, pp. 516-519.
  92. T. H. Hubing, “Bundled cable parameters and their impact on EMI measurement repeatability,” Proc. of the 1990 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 1990, pp. 576-580.
  93. T. H. Hubing and J. F. Kauffman, “Some modifications to the numerical electromagnetics code and their effects,” Proc. of the Sixth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1990, pp. 54-61.
  94. T. H. Hubing, “The effect of cable terminations on EMI measurements,” Proc. of the 1989 IEEE Symposium on Electromagnetic Compatibility, Denver, CO, May 1989, pp. 357-359.
  95. T. H. Hubing and J. F. Kauffman, “Modeling unintentional sources of electromagnetic radiation,” Proc. of the Fifth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1989, pp. 153-158.
  96. J. Fan, Y. Ren, J. Chen, J. Drewniak, T. Hubing, T. Van Doren and R. DuBroff, “RF isolation using power islands in DC power bus design,” Proc. of the 1999 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 1999, pp. 838-843.
  97. T. Hubing, J. Chen, J. Drewniak, T. Van Doren, Y. Ren, J. Fan, and R. DuBroff, “Power bus noise reduction using power islands in printed circuit board designs,” (Invited) Proc. of the 1999 Int. Symp. on EMC, Tokyo, Japan, May 1999, pp. 1-4.
  98. M. Tanaka, W. Cui, X. Luo, J. Drewniak, T. Hubing, T. Van Doren, and R. DuBroff, “FDTD modeling of EMI antennas,” Proc. of the 1999 Int. Symp. on EMC, Tokyo, Japan, May 1999, pp. 560-563.
  99. M. Li, S. Radu, J. Drewniak, T. Hubing, T Van Doren, R. DuBroff, “An EMI estimate for shielding enclosure design,” Proc. of the 13th International Zurich Symp. And Technical Exhibition on EMC, Zurich, Switzerland, Feb. 1999, pp. 369-374.
  100. J. Fan, H. Shi, J. Drewniak, T. Hubing, R. DuBroff and T. Van Doren, “Incorporating vertical discontinuities in power-bus modeling using a mixed-potential integral equation and circuit extraction formulation,” Proc. of the 7th Topical Meeting on Electrical Performance of Electronic Packaging, West Point, New York, Oct. 1998, pp. 171-174.
  101. Y. Ji, M. Ali, and T. Hubing, "EMC applications of the EMAP5 hybrid FEM/MOM code," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 543-546.
  102. S. Radu, R. E. DuBroff, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "Designing power bus decoupling for CMOS devices," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 375-380.
  103. H. Shi, J. Fan, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "Modeling multilayered PCB power bus designs using a MPIE-based circuit extraction technique," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 647-651.
  104. D. M. Hockanson, J.L. Drewniak, R. E. DuBroff, T. H. Hubing, and T. P. Van Doren, "Consideration of magnetic-field coupling resulting in radiated EMI," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 808-813.
  105. S. Radu, T. Zeeff, J. Nuebel, J.L. Drewniak, T.P. Van Doren, and T.H. Hubing. "The impact of layer stack-up on EMI," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 828-833.
  106. M. Li, S. Radu, J. Nuebel, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "Design of airflow aperture arrays in shielded enclosures," Proc. of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp. 1059-1063.
  107. T. Hubing, N. Kashyap, J. Drewniak, T. Van Doren, and R. DuBroff, “Expert system algorithms for EMC analysis,” Proc. of the 14th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1998, pp. 905-910.
  108. Y. Ji and T. Hubing, “EMAP5: A 3D hybrid FEM/MOM code,” Proc. of the 14th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1998, pp. 928-935.
  109. N. Kashyap, T. Hubing, J. Drewniak, and T. Van Doren, "An expert system for predicting radiated EMI from PCBs," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 444-449.
  110. M. Li, Y. Ji, S. Radu, W. Cui, J. Drewniak, T. Hubing, and T. Van Doren, "EMI from apertures at enclosure cavity mode resonances," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 183-187.
  111. S. Radu, M. Li, D. Hockanson, Y. Ji, J. Drewniak, T. Hubing, and T. Van Doren, "Investigation of internal partitioning in metallic enclosures for EMI Control," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 171-176.
  112. S. Radu, Y. Ji, J. Drewniak, T. Van Doren, and T. Hubing, "Identifying an EMI source and coupling path in a computer system with sub-module testing," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 165-170.
  113. S. Britt, D. Hockanson, F. Sha, J. Drewniak, T. Hubing, and T. Van Doren, "Effects of gapped guard traces on radiated EMI," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 159-164.
  114. M. Li, S. Radu, J. Nuebel, J. Drewniak, T. Hubing, and T. Van Doren, "Reducing EMI through shielding enclosure perforations employing lossy materials: FDTD modeling and experiments," Proc. of the 13th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1997, pp. 1070-1076.
  115. H. Shi, F. Sha, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and F. Yuan, "Simulation and measurement for decoupling on multilayer PCB DC power buses," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 430-435.
  116. K. P. Ma, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "A comparison of an FDTD thin-slot algorithm and method of moments for modeling slots near corners," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 386-390.
  117. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and C. W. Lam, "Experimental and numerical investigations of fundamental radiation mechanisms in PCB designs with attached cables, Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 305-310.
  118. T. Hubing, J. Drewniak, T. Van Doren, and N. Kashyap, "An expert system approach to EMC modeling," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 200-203.
  119. T. Hubing and J. Drewniak, "Computer modeling tools for EMC," Proc. of the 12th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1996, pp. 857-860.
  120. J. L. Drewniak, F. Sha, T. H. Hubing, T. P. Van Doren, and J. Shaw, “Diagnosing and modeling common-mode radiation from printed circuit boards with attached cables,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 465-470.
  121. T. H. Hubing, T. P. Van Doren, F. Sha, J. L. Drewniak, and M. Wilhelm, “An experimental investigation of 4-layer printed circuit board decoupling,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 308-312.
  122. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “FDTD modeling of thin wires for simulating common-mode radiation from structures with attached cables,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 168-173.
  123. J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and F. Sha, “Integrating EMC laboratory exercises into undergraduate electromagnetics,” Proc. of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, Aug. 1995, pp. 35-40.
  124. J. L. Drewniak, T. H. Hubing, T. P. Van Doren, and P. Baudendistal, “Modeling power bus decoupling on multilayer printed circuit boards,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 456-461.
  125. T. H. Hubing, T. P. Van Doren, and J. L. Drewniak, “Identifying and quantifying printed circuit board inductance,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 205-208.
  126. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “Application of the finite-difference time-domain method to radiation from shielded enclosures,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 83-88.
  127. R. L. Hill, T. P. Van Doren, T. H. Hubing, J. Drewniak, and F. Gisn, “Common mode currents induced on wires attached to multilayer printed wire boards with segmented ground planes,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 116-120.
  128. J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, “Investigation of fundamental mechanisms of common-mode radiation from printed circuit boards with attached cables,” Proc. of the 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, Aug. 1994, pp. 110-115.
  129. T. H. Hubing, “A modular approach to numerical EM modeling,” Proc. of the IEEE APS Int. Symposium, Seattle, WA, June 1994, vol. 1, pp. 388-391.
  130. T. Hubing, C. Hong-Him Lim, and J. Drewniak, "A geometry description language for 3D electromagnetic analysis codes," Proc. of the 10th Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1994, pp. 417-422.
  131. T. H. Hubing, P. Grover, T. Van Doren, J. Drewniak, and L. Hill, “An algorithm for automated printed circuit board layout and routing evaluation,” Proc. of the 1993 IEEE International Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 1993, pp. 318-321.
  132. T. H. Hubing and M. W. Ali, “EMC applications of EMAP-2: A 3D finite element modeling code,” Proc. of the 1993 IEEE International Symposium on Electromagnetic Compatibility, Dallas, TX, Aug. 1993, pp. 279-283.
  133. T. H. Hubing and M. W. Ali, “Learning about EM theory and EM modeling by analyzing printed circuit boards in an enclosure,” Proc. of the Ninth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1993, pp. 564-568.
  134. T. H. Hubing, “Using commercial CAD packages to interface with 3-D EM modeling codes,” Proc. of the Eighth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1992, pp. 607-610.
  135. T. H. Hubing, “Numerical techniques for EMI source modeling: A review of progress,” Proc. of the Eighth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1992, pp. 413-417.
  136. T. H. Hubing, “A survey of numerical techniques for modeling sources of electromagnetic interference,” Proc. of the Seventh Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1991, pp. 516-519.
  137. T. H. Hubing, “Bundled cable parameters and their impact on EMI measurement repeatability,” Proc. of the 1990 IEEE International Symposium on Electromagnetic Compatibility, Washington D.C., Aug. 1990, pp. 576-580.
  138. T. H. Hubing and J. F. Kauffman, “Some modifications to the numerical electromagnetics code and their effects,” Proc. of the Sixth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1990, pp. 54-61.
  139. T. H. Hubing, “The effect of cable terminations on EMI measurements,” Proc. of the 1989 IEEE Symposium on Electromagnetic Compatibility, Denver, CO, May 1989, pp. 357-359.
  140. T. H. Hubing and J. F. Kauffman, “Modeling unintentional sources of electromagnetic radiation,” Proc. of the Fifth Annual Review of Progress in Applied Computational Electromagnetics, Monterey, CA, Mar. 1989, pp. 153-158.
Clemson University