Current Research

Thermal analysis of Printed Circuit Boards and Sandwich Materials

Principal Investigator:

Mohammed Omar

Graduate Student(s):

Rohit Parvataneni
Ahmed Mayyas

Sponsor(S):

Toyota Engineering and Manufacturing of North America, TEMA

Brief Abstract:

This project aims at analyzing the thermal signature of PCB to help correlate it with their behavior and quality.     

Impact:

Real-time quality assurance of PCB while in operation.

Project schedule:

Initiated in 2009 to be completed in 2010.

Preliminary results:

Basic correlations of the thermal signature of PCB with its quality metrics.